Current Volume 8 - 2022

Solid-Liquid Interdiffusion Bonding between Ti/Ni/Ag/Sn Backside Metallized Si Chips and Cu/Al2O3 - DBC Substrates with Au/Pd/Ni Surface Finish

Kuan-Yu Chiu, Pei-Ing Lee
Publication date: February 2022
Page(s): 1-7
DOI: 10.11159/ijmmme.2022.001