International Journal of Mining, Materials, and Metallurgical Engineering (IJMMME)
International Journal of Mining, Materials, and Metallurgical Engineering (IJMMME)
ISSN: 2562-4571
Current Volume - 2024
Ultra-Thin Cu Nano-Twinned Films Sputtered On Si Wafers for Low Temperature Hybrid Bonding Of Advanced 3D-IC PackagesZi-Hong Yang, Yen-Ting Chen, Yin-Hsuan Chen, and Tung-Han Chuang
Publication date: February 2024
Page(s): 1-7
DOI: 10.11159/ijmmme.2024.001