Current Volume - 2024

Ultra-Thin Cu Nano-Twinned Films Sputtered On Si Wafers for Low Temperature Hybrid Bonding Of Advanced 3D-IC Packages

Zi-Hong Yang, Yen-Ting Chen, Yin-Hsuan Chen, and Tung-Han Chuang
Publication date: February 2024
Page(s): 1-7
DOI: 10.11159/ijmmme.2024.001

Influence of Flux Agent Composition in A-TIG Welding Of Cu-ETP Sheets

Matija Bušić, Sanja Šolić, Vlado Tropša and Damjan Klobčar
Publication date: December 2024
Page(s): 8-16
DOI: 10.11159/ijmmme.2024.002